In this paper, self-assembled nanosphere hot stamping technology is used to spin-coat SiO2 nanosphere solution on a substrate coated with polyacrylic acid (PAA) film and polystyrene (PS) film to form a three-dimensional close-packed nanosphere structure by self-assembly. Next, a hot melt-sinking process is performed to form a periodic, hexagonal close-packed nano-bowl array on the PS film, and then the PAA film is removed using the hydrolysis characteristics of the PAA, and the PS film is turned over and moved to the silicon wafer substrate. The PS film is etched by oxygen Etching to obtain a nanohole array mask, and finally, a large-area, periodic Al nano-disk array is prepared by combining the electron beam evaporation with Al plating. At the same time, the importance of the uniformity of three-layer membrane structure to the preparation of large-area and periodic nano-disk array was also studied. The preparation of disk array based on self-assembly embossing technology is simpler, more efficient and lower cost than traditional nanometer fabrication technology. At the same time, it has potential applications in basic research of new optical elements and solar photovoltaic equipment.
Key words
Self-assembly /
Spin coating /
hot melt-sinking /
hole array mask /
disk array
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